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2026 |
Jun. 30
  • J-Link
  • Press releases 2026
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Image showing the "J-Link Ultra" device against a dark background with circuit patterns. Key features listed include "Compact Housing," "Download speeds up to 4 MB/S," and "Real-Time Transfer (RTT)." The SEGGER logo is visible, and the device is depicted prominently on the right.

SEGGER redesigns J-Link Ultra with compact housing and USB-C connectivity

SEGGER announces a redesigned J-Link Ultra debug probe featuring a compact housing with USB Type-C connectivity and integrated mounting holes.

With a footprint smaller than a credit card, the new design reduces the space required in development and test environments while maintaining the high-speed download, Real-Time Transfer (RTT), and debug performance users expect from J-Link Ultra.

The redesign responds to the evolving needs of embedded developers. As workspaces become more integrated and portable, and CI/CD systems increasingly rely on automated test rigs, the new J-Link Ultra is designed for easy mounting and installation wherever space is limited. 

“The new design brings the same high-speed performance and advanced functionality users know from J-Link Ultra to a much smaller housing,” says Erik Loehr, Product Manager J-Link at SEGGER. “Whether used on the desktop or installed in automated test fixtures, the redesigned probe fits seamlessly into modern development environments.”

J-Link Ultra fully integrates into the existing J-Link ecosystem, supporting Embedded Studio, Visual Studio Code as well as all other major embedded IDEs on Windows, Linux, and macOS. Existing workflows, scripts, and development environments can continue to be used without modification.

The probe also continues to provide full support for advanced features such as unlimited flash breakpoints, power profiling, and the complete J-Link software suite, including Ozone and J-Flash.

The redesigned compact housing will be the new standard for J-Link Ultra.

For more information, visit the J-Link Ultra page at www.segger.com.